Diamond Cutting Lcone4 PDF  


The Laser Lcone4 Machine has been developed especially for diamond sawing, bruiting And 4 Process Diamond Cutting With
Smooth Surface with High Production. All lasers have a long resonator in order to have a pulse with enough power to cut in the
stone without having the risk of damaging the stones. It allows the pulse shaping and power modulation during the whole process in order to minimize risks and adapt the power during the 4 Process.

Optional Accessories

Two Fixture On one Base Plate For Sawing,Coneing & Bruting
Without Disturbe Base Plate.
Two Side Sawing (TSS) With one side Focusing Fancy, Cone
And Profile Cutting With Pc Interface.
All in one machinecan be supplied on Request Automatic air

Low weight loss compared to other Laser machines.
Smooth cutting surface.
Breakage rate almost ‘NIL’.
Special software for TSS cutting & Bending.
Automatic data setting system.
Exceptional Reliability: through peak power control device.
Senses the marking line.
Automatic Stroke Control for Higher Productivity.
Automatic Detection of Diamond Completion / Fixture Completion.
Peak Power Control Device for Utmost Safety of Diamond.
Unique Voice Prompt To Minimize The Operator Interface.
Automatic RF mode.
Changing Parameters at real time.

Technical Specification
Laser system
Laser Source Nd:YAg Diode Pumped
Wavelength 1064 ± 10 nm
Beam Mode M2 < 1.2
Laser power 50 to 75 Watts
Divergence < 2 mrad
Peak to peak stability 2 %
Frequency up to 50 khz
Power consumption < KVA
Electricity 230 ± 10 % V AC
1 Phase
Room temperature 20°C to 25°C
CNS system
Axis travel 130 mm X 130 mm X 70 mm
Accuracy 2 micron/ 25mm
Repeatability 2 micron / 25mmBidirectional
Straightness 2 micron / 25mm
Drive Servo with 17bit Encoder
Weight 250kg
Size (in mm) 1800*800*1600mm
Cooling water De – Ionized Water